项目
Project |
量产
Mass production |
样品
Sample |
|
材料
Material |
高Tg FR-4、无卤素、高频、高速、 High Tg FR-4, halogen-free, high-frequency,high-speed |
||
表面处理
Surface treatment |
有铅喷锡、无铅喷锡、防氧化、化学沉镍金、化学沉锡、化学沉银、镀硬金、镍钯金 There are lead tin spray, lead-free tin spray, anti-oxidation, electroless nickel gold, electroless tin, electroless silver, hard gold plating, Nipdau |
||
特殊工艺板
Special craft board |
高频混压、高速、厚铜、HDI、特性阻抗、树脂塞孔、背钻、刚柔结合 High frequency mixed pressure,High-speed,Thick copper,HDI,characteristic impedance, resin plug hole, back drill,rigid-flexible |
||
最高层数
Maximum number of layers |
20
|
42
|
|
成品板厚
Finished board thickness |
最小
The smallest |
0.5mm(20mil)
|
0.3mm(12mil)
|
最大
Maximum |
5.0mm(200mil)
|
8.0mm(320mil)
|
|
板厚公差 |
板厚 Board thickness ≤1.0mm(40mil):±0.1mm(4mil) 板厚 Board thickness >1.0mm(40mil):±10%
|
版权所有:广德宝达精密电路有限公司 备案号: 皖ICP备13014570号-1 网站建设:中企动力 杭州