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项目
Project |
量产
Mass production |
样品
Sample |
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材料
Material |
高Tg FR-4、无卤素、高频、高速、 High Tg FR-4, halogen-free, high-frequency，high-speed |
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表面处理
Surface treatment |
有铅喷锡、无铅喷锡、防氧化、化学沉镍金、化学沉锡、化学沉银、镀硬金、镍钯金 There are lead tin spray, lead-free tin spray, anti-oxidation, electroless nickel gold, electroless tin, electroless silver, hard gold plating, Nipdau |
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特殊工艺板
Special craft board |
高频混压、高速、厚铜、HDI、特性阻抗、树脂塞孔、背钻、刚柔结合 High frequency mixed pressure，High-speed,Thick copper,HDI，characteristic impedance, resin plug hole, back drill，rigid-flexible |
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最高层数
Maximum number of layers |
20
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42
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成品板厚
Finished board thickness |
最小
The smallest |
0.5mm(20mil)
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0.3mm(12mil)
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最大
Maximum |
5.0mm(200mil)
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8.0mm(320mil)
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板厚公差 |
板厚 Board thickness ≤1.0mm(40mil):±0.1mm(4mil) 板厚 Board thickness >1.0mm(40mil):±10%
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