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项目
Project |
量产
Mass production |
样品
Sample |
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材料
Material |
普通Tg、高Tg FR-4、无卤素板、金属基板、高频板材（Rogers、Arlon、Taconic、Nelco）、聚酰亚胺（PT） Ordinary Tg, high Tg FR-4, halogen-free board, metal substrate, high-frequency board (Rogers, Arlon, Taconic, Nelco), polyimide (PT) |
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表面处理
Surface treatment |
有铅喷锡、无铅喷锡、防氧化、化学沉镍金、化学沉锡、化学沉银、镀硬金、镀纯厚金 There are lead tin spray, lead-free tin spray, anti-oxidation, electroless nickel gold, electroless tin, electroless silver, hard gold plating, pure thick gold plating |
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特殊工艺板
Special craft board |
厚铜板、盲/埋孔板、特性阻抗板、高频混压金层板、金属基板、树脂塞孔板、背钻板 Thick copper plate, blind/buried hole plate, characteristic impedance plate, high frequency mixed pressure gold layer plate, metal substrate, resin plug hole plate, back drill plate |
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最高层数
Maximum number of layers |
20
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40
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成品板厚
Finished board thickness |
最小
The smallest |
0.5mm(20mil)
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0.1mm(4mil)
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最大
Maximum |
3.5mm(140mil)
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605mm(260mil)
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板厚公差 |
板厚 Board thickness ≤1.0mm(40mil):±0.1mm(4mil) 板厚 Board thickness >1.0mm(40mil):±10%
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